Equipment and reservation

TRANSMISSION ELECTRON MICROSCOPES

(TEMs)

FOCUSED ION BEAM SCANNING ELECTRON MICROSCOPE

(FIBSEM)

Tecnai 12 G2

(FEI, Eindhoven, Netherlands)

TEM Tecnai 20

 

 

📅 Reservation   🏢 C06.1930.A   ☎ 95 319

User manual

Contact Hervé Blanchard (☎ 95 263) for training before using TEMs

  • Acceleration voltage: 80 kV
  • e- source: W filament
  • MegaView III side-mounted CCD camera: 1376 × 1032 pix
    • chip size: 10.2 × 10.2 mm2
    • pixel size:  6.45 × 6.45 µm2
    • pixel clock: 20.0 MHz
    • dynamic range: 12 bit
    • exposure time: 100 µs - 160 s
    • scintillator: high sensitive phosphor
  • iTEM camera software (Olympus-Soft Imaging Solutions)
  • goniometer tilt: ±70°

Morgagni 

(FEI, Eindhoven, Netherlands)

TEM Morgagni

 

 

📅 Reservation   🏢 C06.1731.A   ☎ 95 312

 

Contact Hervé Blanchard (☎ 95 263) for training before using TEMs

  • Acceleration voltage: 80 kV
  • e- source: W filament
  • Veleta side-mounted CCD camera: 2048 × 2048 pix
    • chip size: 16.67 × 16.67 mm2
    • pixel size:  7.4 × 7.4 µm2
    • pixel clock: 24.6 MHz
    • dynamic range: 14 bit
    • exposure time: 100 µs - 160 s
    • scintillator: high sensitive phosphor
  • iTEM camera software (Olympus-Soft Imaging Solutions)
  • goniometer tilt: ±70°

Helios 660 Nanolab DualBeam FIBSEM

(FEI, Eindhoven, Netherlands)

FIBSEM Helios

 

📅  Reservation   🏢 E01.3359.A    ☎ 94 134

 

Contact Bohumil Maco (☎  95 305) to analyse samples with this microscope

  • Acceleration voltage: 200 V - 30 kV
  • e- source: Schottky thermal field emission gun (FEG)
  • Ion source: Ga+ liquid metal ion
  • Ion probe current: 0.6 pA - 65 nA
  • Ion vs. e- geometry: 52°
  • Gas injection system (GIS): Pt, C
  • SEM imaging: up to 6144 × 4096 pix

 

  • FIB milling and imaging: Auto Slice and View (ASV 4.2) software
  • Tilling and stitching large FOV areas and CLEM:  MAPS 3.3 software